Provides a quick and easy way to rework boards fitted with surface mount devices, even in RoHS products. It works by blowing 1000 watts of heated air onto the board your are working on, melting the solder on the SMD?pads in the process. It is fully temperature adjustable between 100°C and 480°C. The high flow air pump blows up to 40 litres per minute and is also adjustable. It includes four nozzle sets designed to direct hot air around the chip or device being removed from the board. These suit SOIC, CHIP, QFP, PLCC & BGA devices, however the nozzles can be used for a wide variety of SMD components. Also supplied with SMD?tweezer set &?IC?removal tool. 

Important: Air flow rate and heater power are essential specifications on a re-work station. The 1000W heater and 40l/min blower capacity make this Micron unit a truly professional grade unit capable of every day use in commercial applications.
 

Features

  • Low vibration air pump
  • Suits leaded &?lead free solder (RoHS)
  • Quality nichrome heating element
  • Sturdy all metal housing
  • Rapid heat up
  • Long service life
  • Includes 4 nozzles, SMD?tweezer set, chip removal tool & spare heating element
  • Individual temperature & air flow adjustments
  • Auto fan cooling extends tip life
  • ESD safe
  • Energy authority approved
  • Burn proof lead
  • Temperature lockout

(T1287)

12 month warranty

SKU T1287
Model # T1287
Barcode # 9321758174975
Unit Of Measure each

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